Shenzhen & Dongguan Dual-Site Manufacturing

Professional PCB
Manufacturing Built Right

A full-capability PCB, PCBA, and FPC manufacturing center in Shenzhen, China. From 1-layer prototypes to 40-layer HDI production boards — serving medical, automotive, IoT, industrial, and telecommunications clients worldwide.

2.5mil
Min Trace / Space
1–40L
Layer Count
3days
Prototype Turnaround
8:1
Aspect Ratio
99.9%
Quality Pass Rate
ISO 9001 · 14001
UL · RoHS · REACH
// PCB_CAPABILITIES.json ACTIVE
01
Trace/Space
2.5 mil
02
Thickness
0.25-3.5mm
03
Impedance
+/-8%
04
Flammability
94V-0
05
Aspect Ratio
8:1
06
Panel Size
860x610

PCB Manufacturing Process

Click any step to see the equipment and process detail. Every board passes through the full sequence before leaving our facility.

STEP 01

What We Manufacture

A complete range of PCB, PCBA, and FPC solutions — from single prototype to high-volume production

CORE SERVICE

Multilayer PCB

Multilayer PCB fabrication from 1 to 40 layers, supporting FR4, high-frequency Rogers, polyimide, and specialty substrates.

1–40 layer fabrication
Controlled impedance
High-multilayer HDI boards
Rigid-flex combination
ADVANCED

HDI PCB

High Density Interconnect PCB with blind/buried vias, via-in-pad, and laser microvias for compact, high-performance designs.

3-stage HDI
2-stage HDI + rigid-flex
Any-layer interconnect
Microvia laser drilling
SPECIALTY

Rigid-Flex PCB

Rigid-flex and high-multilayer rigid-flex boards for space-constrained applications requiring dynamic flex zones and 3D packaging.

High-multilayer rigid-flex
2-stage HDI + rigid-flex
Dynamic and static flex
Polyimide substrates
ASSEMBLY

PCBA Assembly

Full turnkey PCB assembly with SMT, DIP, and BGA placement. Component sourcing, DFM review, and functional testing included.

POS mainboards
Military-grade card boards
Router & 4G module boards
Automotive head units
FLEXIBLE

FPC Flexible Circuit

Flexible printed circuit boards for applications requiring bendability, space savings, and lightweight interconnects.

Consumer electronics
Automotive electronics
Industrial control systems
PROTOTYPE

Quick-Turn Prototype

PCB prototypes from 3 days with MOQ of 1 piece. DFM analysis included on every order for engineering validation.

3-day double-sided boards
6-day multilayer boards
DFM review included
Global shipping support
SURFACE FINISH

Surface Finish Options

HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold, and Soft Gold — recommended for your application and reliability needs.

HASL Lead-Free
ENIG (Gold)
OSP
Immersion Silver / Tin
QUALITY

PCB Testing

Electrical testing, AOI, X-ray inspection, and flying probe testing. Every board verified against specification before shipment.

Flying probe test
AOI inspection
X-ray inspection
Impedance verification
ENGINEERING

Design Support

DFM analysis and PCB layout optimization on every order. Our engineers review your Gerber files before production and flag any yield or reliability issues.

DFM analysis
Gerber review
Stack-up design
Impedance calculation
SIGNAL INTEGRITY

Impedance Control

Controlled impedance PCBs for high-speed digital, RF, and microwave applications. Every impedance-critical board is tested and certified before shipment.

±8% impedance tolerance
Single-ended & differential
Coupons tested & certified
RF & microwave stackups
ADVANCED TECHNOLOGY

Via-in-Pad

Via-in-pad and via filling technology for high-density designs. Resin-filled and copper-capped vias for BGA and fine-pitch component placement.

Resin-filled & copper-capped
BGA / fine-pitch support
Stacked & staggered vias
Planarity for assembly
POWER ELECTRONICS

Thick Copper PCB

Heavy copper PCBs from 3.5 oz to 10 oz for power supply, automotive, and industrial applications requiring high current capacity and thermal management.

3.5–10 oz copper weight
High current capacity
Enhanced thermal dissipation
Power / automotive grade

Technical Specifications

Precision manufacturing capabilities covering everything from ultra-fine traces to high aspect-ratio vias

MIN LINE WIDTH / SPACING
2.5mil
Ultra-fine trace manufacturing
BOARD THICKNESS
0.25–3.5mm
Full thickness range
MAX PANEL SIZE
860×610mm
Large-format processing
IMPEDANCE CONTROL
±8%
High-precision impedance
FLAME RETARDANT
UL 94V-0
Highest flame rating
ASPECT RATIO
8:1
High aspect-ratio via capability

Fast Turnaround

From double-sided prototypes to advanced HDI boards — matching your urgency at every stage

3D
Double-Sided
3 Days
2-Layer PCB
6D
Multilayer
6 Days
4+ Layer PCB
3W
Special Board
3 Weeks
Rigid-Flex / Thick Copper
3W
HDI Board
3 Weeks
High Density Interconnect

Built on Standards

Multi-stage inspection and international quality certifications on every production run

ISO 9001
Quality Management System certified
RoHS Compliant
Restriction of Hazardous Substances
REACH Compliant
EU chemical regulation compliance
UL Listed
Underwriters Laboratories certified
IPC-A-600
Acceptability of printed boards
IPC-A-610
Acceptability of PCB assemblies
99.9% Pass Rate
Quality pass rate across all runs
Multi-Stage Inspection
AOI, X-ray, flying probe at every stage
ISO 9001:2015
ISO 14001:2015
ISO 13485:2016
RoHS
REACH
UL
IPC-A-600
IPC-A-610
IPC J-STD-001

Industries We Serve

Deep experience in industries where precision is non-negotiable

Consumer Electronics
Smartphones, wearables, smart home
Automotive Electronics
Head units, ADAS, EV charging
Industrial Control
PLC, motor drives, automation
Medical Devices
Patient monitoring, diagnostics
IoT & Telecom
5G, routers, wireless modules
Military & Aerospace
Rugged boards, high-reliability

Built on Standards. Driven by Results.

Dual-site manufacturing in Shenzhen Bao'an & Dongguan Songshan Lake — trusted by international clients for technical depth, speed, and reliability

01
One-Stop Manufacturing
PCB fabrication, component sourcing, PCBA assembly, and testing under one roof. No coordination overhead, no handoff delays.
02
Fast BOM Quotation
Dedicated procurement engineers deliver competitive component pricing through 10+ years of distributor relationships across China and internationally.
03
Multi-Stage Inspection
AOI, X-ray, flying probe, and electrical testing at every critical stage. 99.9% quality pass rate across all production runs.
04
Industry Specialization
Deep experience in medical devices, 5G, robotics, IoT, and power supply — industries where precision is non-negotiable.

Factory Location

Two manufacturing bases in the Greater Bay Area — customers and partners are welcome to visit our facilities

Shenzhen Bao'an Facility
Shajing, Bao'an District, Shenzhen — PCB fabrication, HDI & quick-turn prototype lines
Dongguan Songshan Lake Facility
Songshan Lake Hi-Tech Zone, Dongguan — high-multilayer, rigid-flex & volume production

Start Your PCB Project

Whether you need a quick prototype or volume production, our engineering team is ready to provide technical support and competitive pricing. Contact us for a tailored solution.

PHONE / WHATSAPP
+86 138 2310 9230
EMAIL
leo@ipcba.com.cn
FACTORY ADDRESS
Shenzhen Bao'an · Dongguan Songshan Lake

Get a Quote from Leo

+86 138 2310 9230
Send Email
Shenzhen Bao'an Shajing Facility
Dongguan Songshan Lake Facility